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- Academic unit or major
- Graduate major in Materials Science and Engineering
- Instructor(s)
- Chai Yaw Wang
- Class Format
- Lecture
- Media-enhanced courses
- Day/Period(Room No.)
- Tue3-4(S8-501) Fri3-4(S8-501)
- Group
- 大岡山
- Course number
- MAT.M419
- Credits
- 2
- Academic year
- 2018
- Offered quarter
- 1Q
- Syllabus updated
- 2018/3/20
- Lecture notes updated
- -
- Language used
- English
- Access Index
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Course description and aims
This course provides a comprehensive introduction to a range of microscopy techniques (viz. Optical and electron microscopies). The syllabus includes brief introduction to the structure of crystalline solids, imperfections in solid materials and basic concepts of microscopy. Students will explore the main construction and basic principles of various microscopy techniques, the strengths and weaknesses of each technique, and be better planned of selecting a suitable microscopy technique for their research purpose. Other topics include basics of optical properties, electron-solid interactions, electron diffraction and image formation, and discussion of different techniques of specimen preparations. Electron diffraction analyses and X-ray energy-dispersive spectrometry for microstructure characterization, phase identification and crystallography analyses of a wide spectrum of solid materials. A brief introduction to the very recent development of advanced aberration corrected scanning transmission electron microscopy for imaging and spectrometry at atomic resolution.
Student learning outcomes
By the end of this course, students will be able to:
(a) Understand the basic construction, capabilities and limitations of each microscopic technique.
(b) Understand the different modes of image formation in each microscopic technique for microstructure and crystallographic characterization in solid materials.
Keywords
Optical and electron microscopies, nanostructure, microstructure, crystallography, properties, solid materials
Competencies that will be developed
| ✔ Specialist skills | Intercultural skills | ✔ Communication skills | Critical thinking skills | Practical and/or problem-solving skills |
Class flow
Assignments will be given during lectures to improve understanding.
Course schedule/Required learning
| Course schedule | Required learning | |
|---|---|---|
| Class 1 | Introduction | Historical and current developments of microscopy in materials science. |
| Class 2 | Structure of crystalline solids | Brief introduction to the concepts of lattice, basis, crystal structure systems and streographic projection. |
| Class 3 | Imperfections in solid materials | Introduction to various types of defects in solid materials |
| Class 4 | Optical microscopy | Basic structure and principles of optical microscopy, properties of light, image formation, magnification and resolution. |
| Class 5 | Scanning electron microscopy (SEM)-I:Introduction and Imaging | Instrumentation, electron beam-specimen interactions, concepts of resolution and depth of field and image formation based on secondary and backscattered electrons |
| Class 6 | Scanning electron microscopy (SEM)-II: Lens Aberrations and X-ray microanalysis. | Descriptions of various lens aberrations, generation of characteristic X-rays and a brief introduction to Electron Probe Micro Analyzer (EPMA) |
| Class 7 | Scanning electron microscopy (SEM)-III: Specimen preparation | Introduction to various specimen preparation methods for optical microscopy, SEM and EPMA. Microstructure analyses by Image J software. |
| Class 8 | Transmission Electron microscopy (TEM)-I: Introduction | Introduction to the different components and their functions of a TEM microscope. |
| Class 9 | Transmission Electron microscopy (TEM)-II: Electron scattering and electron diffraction | Electron diffraction, Bragg’s Law and thinking in reciprocal space, indexing diffraction pattern and structure factor calculation. |
| Class 10 | Transmission Electron microscopy (TEM)-III: Electron scattering-continue | Ewald Sphere, bight field and dark field imaging, microstructure and electron diffraction pattern analyses. |
| Class 11 | Transmission Electron microscopy (TEM)-IV: Imaging: mass-thickness contrast and diffraction contrast | Principles of various imaging modes, two-beam condition imaging and defects characterizations |
| Class 12 | Transmission Electron microscopy (TEM)-V: Imaging: mass-thickness contrast and diffraction contrast-continue | Descriptions of the formation of thickness fringes and bend contours. |
| Class 13 | Transmission Electron microscopy (TEM)-VI: Imaging: phase contrast and Z-contrast | Image formation of lattice and moire fringes, and a brief introduction to the high-angle annular dark field (HAADF) imaging by STEM. |
| Class 14 | Transmission Electron microscopy (TEM)-VII: Specimen preparation | Introduction to various techniques of TEM specimen preparation in solid materials. |
| Class 15 | Review | A brief overall review on the optical microscopy, scanning and transmission electron microscopies. |
Textbook(s)
1) William D. Callister, Jr. and David G. Rethwisch, Materials Science and Engineering: An Introduction, (Wiley, 2014, 9th edition)
2) Joseph I. Goldstein, Dale E. Newbury, Patrick Echlin, David C. Joy, Charles Fiori and Eric Lifshin, Scanning Electron Microscopy and X-ray Microanalysis-A Text for Biologists, Materials Scientists and Geologists, (Plenum Press, New York, 1981).
3) David B. Williams and C. Barry Carter, Transmission Electron Microscopy- A Textbook for Materials Science, (Plenum Press, New York, 1996).
Reference books, course materials, etc.
1) Nobuo Tanaka, Ed., Scanning Transmission Electron Microscopy of Nanomaterials- Basics of Imaging and Analysis, (Imperial College Press, 2015)
Assessment criteria and methods
Students are assessed by quizzes, assignments and final examination.
Related courses
- MAT.M313 ： Introduction to solid materials
Prerequisites (i.e., required knowledge, skills, courses, etc.)
Sufficient level of English and some knowledge of crystallography in solid materials are necessary. Students with the ability to imagine 3D structure may be helpful.
Contact information (e-mail and phone) Notice : Please replace from "[at]" to "@"(half-width character).
Suzukakedai, J2 building, 14th floor, Room 1413 (ext. 5578)
chai.y.aa[at]m.titech.ac.jp
Office hours
9:00-18:00
