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School of Engineering
- Undergraduate major in Mechanical Engineering
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- Common courses
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- 工学院，物質理工学院，環境・社会理工学院共通科目
- Liberal arts and basic science courses
- First-Year Courses
- School of Science
- School of Engineering
- School of Materials and Chemical Technology
- School of Computing
- School of Life Science and Technology
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School of Environment and Society
- Department of Architecture and Building Engineering
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- Department of Innovation Science
- Graduate major in Technology and Innovation Management
- Common courses
- Liberal arts and basic science courses
- Academic unit or major
- Graduate major in Electrical and Electronic Engineering
- Instructor(s)
- Wakabayashi Hitoshi Tsutsui Kazuo Yamashita Tenko Nishiguchi Katsuhiko Lin Tsung Ju Matsui Miyako Saito Tomoya Oike Yusuke Sasaki Shun
- Class Format
- Lecture
- Media-enhanced courses
- Day/Period(Room No.)
- Tue7-8(W3-207(W323))
- Group
- -
- Course number
- EEE.D443
- Credits
- 1
- Academic year
- 2024
- Offered quarter
- 1Q
- Syllabus updated
- 2024/3/14
- Lecture notes updated
- -
- Language used
- English
- Access Index
-
Course description and aims
This course provides a comprehensive overview of technological trends in integrated semiconductor devices, which support modern society, from the perspectives of devices, processes, circuit design, and applications. Specifically, students will first learn about the current status and future prospects of logic devices. Next, students will learn about scaling and low power consumption technologies to improve the performance of cutting-edge logic devices. In advanced processes, etching and cleaning technology are focused, which are the key to advanced logic devices. Furthermore, as a design technique for digital circuits, memory-embedded circuits are explained, and examples of applications using cutting-edge semiconductor devices are introduced. Finally, silicon technologies are overviewed from the viewpoint of wafer technology.
These lectures will be provided by instructors from various companies that are leading the semiconductor industry. Through this course, students will learn about the various technological elements that support logic semiconductor devices and the efforts of each company, and will understand the relationship between their own field of expertise and the semiconductor industry, and will develop their ability to develop technology with an eye on the market.
Student learning outcomes
Through this course, the goal is to understand cutting-edge technology trends in semiconductor devices and acquire the skills to develop technology from a bird's-eye view with market awareness in mind. In addition, we aim to gain an understanding of the diverse career paths in the semiconductor industry through experiences in semiconductor technology development provided by corporate instructors from various specialized fields.
Course taught by instructors with work experience
| ✔ Applicable | How instructors' work experience benefits the course |
|---|---|
| Lectures working in semiconductor-related companies will utilize their practical experience to provide systematic education on design, manufacturing and applications of advanced logic devices based on silicon technology. |
Keywords
semiconductor, VLSI, wafer, logic devices, cleaning technology, etching technology, SoC, circuit design, image sensor
Competencies that will be developed
| ✔ Specialist skills | ✔ Intercultural skills | Communication skills | ✔ Critical thinking skills | ✔ Practical and/or problem-solving skills |
Class flow
Mainly face-to-face lectures with online participation from another universities.
Experts in cutting-edge logic devices, process technology, circuit design, and applications will be invited as lecturers, and the lectures will be held in an omnibus format with lectures and reports.
Course schedule/Required learning
| Course schedule | Required learning | |
|---|---|---|
| Class 1 | Advanced logic devices (Structures, Scaling technology) [IBM USA] | Understanding the technological advances driving the miniaturization of advanced logic devices. |
| Class 2 | New-functionality devices for future electronics (Low-power-consumption technology) [NTT] | Understanding new functional device technology for low power consumption technology. |
| Class 3 | Advanced semiconductor process 1 (Etching technology) [Hitachi High-Tech] | Understanding the evolution of etching processing technology through device fabrication process technology. |
| Class 4 | Advanced semiconductor process 2 (Cleaning technology) [SCREEN Semiconductor Solutions] | Understanding cleaning technology that is becoming more sophisticated with device manufacturing process technology. |
| Class 5 | Technology trends of IP development in embedded nonvolatile memory for MCUs [Renesas Electronics Corp.] | Understanding embedded nonvolatile memory in digital integrated circuits. |
| Class 6 | Semiconductor products, market (Image Sensor) [Sony Semiconductor Solutions] | Understanding image sensors, which is an important application along with LSI. |
| Class 7 | Current situation and prospects of Si technology from the viewpoints of wafer technology [SUMCO] | Understanding wafer technology within the semiconductor industry. |
Out-of-Class Study Time (Preparation and Review)
To enhance effective learning, students are encouraged to spend approximately 100 minutes preparing for class and another 100 minutes reviewing class content afterwards (including assignments) for each class.
They should do so by referring to textbooks and other course material.
Textbook(s)
none
Reference books, course materials, etc.
Taur and Ning: Fundamentals of Modern VLSI Devices (ISBN: 978-4621085813)
Sze: Semiconductor Devices: Physics and Technology (ISBN: 978-4782855508)
West, Harris: Integrated circuit design (ISBN: 978-0321696946)
Texts by each lecturer
Assessment criteria and methods
Reports for each class: 100%
Related courses
- EEE.C441 ： VLSI Technology I
- EEE.C442 ： VLSI Technology II
- EEE.D411 ： Semiconductor Physics
- EEE.D592 ： Advanced Topics on Material Analysis and Basics of Plasma Processing for Nano Devices
Prerequisites (i.e., required knowledge, skills, courses, etc.)
It is desirable to have taken undergraduate lectures on semiconductor devices and electronic circuits.
Contact information (e-mail and phone) Notice : Please replace from "[at]" to "@"(half-width character).
Kazuo Tsutsui（tsutsui.k.ac[at]m.titech.ac.jp）
Office hours
Contact by e-mail in advance to schedule an appointment.
Other
Lecture in charge of each session
Class 1：IBM, US Yamashita Tenko, Class 2：NTT Nishiguchi Katsuhiko, Class 3：Hitachi High-Tech Matsui Miyako, Class 4：SCREEN Semiconductor Solutions Lin Tsung Ju, Class 5：Renesas Electronics Corp. Saito Tomoya, Class 6：SONY Semiconductor Solutions Oike Yusuke, Class 7：SUMCO Sasaki Shun.
This lecture is also held as an activity of the Integrated Green-niX College in the Integrated Green-niX research and human resource development, supported by MEXT Initiative to Establish Next-generation Novel Integrated Circuits Centers (X-NICS) JPJ011438.
