It is very important to understand the large-scale integrated circuit (VLSI) technology to support the modern society in the underlying. So in conjunction with VLSI Technology Second, the CMOS integrated circuit will be dicussed, in particular, scaling techniques, miniaturization technology (exposure technique, film forming technique, an etching technique, ion-implantation, CMP techniques, etc.), a memory device technology, sensor technology, actuator technology, interconnect technology, passive device technology, packaging technology, and others.
By course of this lecture, the goals is to understand the large-scale integrated circuits that support modern society. In addition, we aim to be able to apply to the actual integrated circuit design.
Large-scale integrated circuit (VLSI) technology, CMOS integrated circuit, scaling technology, miniaturization technology, exposure technology, film formation technology, etching technology, CMP technology, memory device technology, sensor technology, actuator technology, wiring technology, passive device technology, packaging technology, and others
|Intercultural skills||Communication skills||✔ Specialist skills||Critical thinking skills||Practical and/or problem-solving skills|
|Course schedule||Required learning|
|Class 1||Summary of the large-scale integrated circuits (VLSI) Industry and technology||The understanding about the outline of a large-scale integrated circuit (VLSI) industry and technology|
|Class 2||CMOS integrated circuit and an inverter||The understanding about MOSFET, CMOS, inverter etc|
|Class 3||Logic circuit and low-power circuits||The understanding about logic circuits, low-power consumption circuits, etc|
|Class 4||Amplification circuit and a differential amplifier||The understanding about amplification circuits, a differential amplifier, etc|
|Class 5||Overview of production technologyies (wafer technology and clean technology)||Overview of process technologies, especially wafer technology and clean technology|
|Class 6||Scaling technologies (Lithography technology)||The understanding about the scaling technology and lithography technology|
|Class 7||Film deposition technology and etching technology||The understanding about film deposition technology, etching technology etc|
|Class 8||Ion implantation technology||The understanding about ion implantation technology|
|Class 9||Wet technology and CMP technology, and others||The understanding about wet cleaning and chemical-mechanical polishing technology|
|Class 10||Interconnect technology, passive-device technology, and packaging technology||The understanding about interconnect, passive device and assembling technologies, etc|
|Class 11||Memory device technology||The understanding about memory devices such as latch circuits, SRAM, DRAM, Flash memory, PCM, RRAM, MRAM, STT-MRAM, FeRAM etc|
|Class 12||Sensor device technology and actuator device technology||The understanding about sensor and accuator-device technologies|
|Class 13||Layout technology||The understanding about layout technology|
|Class 14||The latest and future trends including new-type of FETs||The understanding about new type of FET and the future technologies|
|Class 15||Test, yield and reliability for introfduction to VLSI engineering II||The understanding about the test yield and reliability, and the introduction to VLSI engineering II|
/Fundamentals of Modern VLSI Devices, 2nd Edition, Yuan Taur and Tak H. Ning, Cambridge University Press
/Semiconductor Manufactureing Technology, Michael Quirk and Julian Serda, Prentice Hall
/Nanoelectronics and Information Technology, Rainer Waser, Wilery-VCH
Print out uploaded data on the OCW / OCW-i by yourself.
No Examination. However, submit the report after lectures.
Hitoshi Wakabayashi (wakabayashi.h.ab[at]m.titech.ac.jp)
Kuniyuki Kakushima (kakushima.k.aa[at]m.titech.ac.jp)