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2016　Materials and Processes for Microsystems

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Academic unit or major
Graduate major in Electrical and Electronic Engineering
Instructor(s)
Oda Shunri  Milne William Ireland 
Class Format
Lecture     
Media-enhanced courses
Day/Period(Room No.)
Intensive ()  
Group
-
Course number
EEE.D591
Credits
1
Academic year
2016
Offered quarter
3Q
Syllabus updated
2016/11/29
Lecture notes updated
2016/11/7
Language used
English
Access Index

Course description and aims

Microsystems (otherwise known as MicroElectroMechanical Systems, MEMS) are mechanical devices that are fabricated on a micrometre scale using techniques more commonly associated with the semiconductor industry for the fabrication of microelectronic devices. They can be classified as either passive devices (e.g. cantilevers, beams) or actuators (e.g. electrostatic drives, thermal expansion actuators) or sensors (e.g. gyroscopes, pressure sensors) and the worldwide market for these devices has expanded greatly in recent years. This course will introduce both the processing methods by which these devices are manufactured and the properties of the materials which are employed, including traditional silicon-based technology and new materials, such as diamond-like carbon, polymers and biological thin films.

Student learning outcomes

Case studies will be used with particular reference to one sensing and one actuating application to exemplify how materials and fabrication processes are integrated

Keywords

MEMS, silicon-based materials, carbon-based materials, fabrication processes, sensor application

Competencies that will be developed

✔ Specialist skills ✔ Intercultural skills Communication skills Critical thinking skills ✔ Practical and/or problem-solving skills

Class flow

Case studies will be used with particular reference to one sensing and one actuating application to exemplify how materials and fabrication processes are integrated

Course schedule/Required learning

  Course schedule Required learning
Class 1 Overview of Microsystems technology and introduction of principal case studies Overview of Microsystems technology
Class 2 Silicon-based materials including c-Si, Amorphous Si and poly Si and silicon alloys Silicon-based materials
Class 3 Carbon-based materials including Diamond, Diamond Like Carbon and CNTs, Metals, TCOs and polymers Carbon-based materials
Class 4 Material selection Material selection
Class 5 Patterning and wet Etching Patterning and wet Etching
Class 6 Other etching techniques, Bonding, planarisation and biomicrosystems Other etching techniques, Bonding, planarisation and biomicrosystems
Class 7 Process flow and Yield Process flow and Yield

Textbook(s)

NA

Reference books, course materials, etc.

Handout

Assessment criteria and methods

Report

Related courses

  • EEE.D591 ： Materials and Processes for Microsystems

Prerequisites (i.e., required knowledge, skills, courses, etc.)

NA

Contact information (e-mail and phone)    Notice : Please replace from "[at]" to "@"(half-width character).

soda[at]pe.titech.ac.jp

Office hours

Appointment by e-mail

Other

NA

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