2019 VLSI Technology I

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Academic unit or major
Graduate major in Electrical and Electronic Engineering
Instructor(s)
Wakabayashi Hitoshi  Kakushima Kuniyuki 
Course component(s)
Lecture
Day/Period(Room No.)
Mon1-2(G221)  Thr1-2(G221)  
Group
-
Course number
EEE.C441
Credits
2
Academic year
2019
Offered quarter
1Q
Syllabus updated
2019/3/24
Lecture notes updated
-
Language used
Japanese
Access Index

Course description and aims

It is very important to understand the large-scale integrated circuit (VLSI) technology to support the modern society in the underlying. So in conjunction with VLSI Technology Second, the CMOS integrated circuit will be dicussed, in particular, scaling techniques, miniaturization technology (exposure technique, film forming technique, an etching technique, ion-implantation, CMP techniques, etc.), a memory device technology, sensor technology, actuator technology, interconnect technology, passive device technology, packaging technology, and others.

Student learning outcomes

By course of this lecture, the goals is to understand the large-scale integrated circuits that support modern society. In addition, we aim to be able to apply to the actual integrated circuit design.

Keywords

Large-scale integrated circuit (VLSI) technology, CMOS integrated circuit, scaling technology, miniaturization technology, exposure technology, film formation technology, etching technology, CMP technology, memory device technology, sensor technology, actuator technology, wiring technology, passive device technology, packaging technology, and others

Competencies that will be developed

Intercultural skills Communication skills Specialist skills Critical thinking skills Practical and/or problem-solving skills
- - - -

Class flow

Lecture

Course schedule/Required learning

  Course schedule Required learning
Class 1 Summary of the large-scale integrated circuits (VLSI) Industry and technology The understanding about the outline of a large-scale integrated circuit (VLSI) industry and technology
Class 2 CMOS integrated circuit and an inverter The understanding about MOSFET, CMOS, inverter etc
Class 3 Logic circuit and low-power circuits The understanding about logic circuits, low-power consumption circuits, etc
Class 4 Amplification circuit and a differential amplifier The understanding about amplification circuits, a differential amplifier, etc
Class 5 Overview of production technologyies (wafer technology and clean technology) Overview of process technologies, especially wafer technology and clean technology
Class 6 Scaling technologies (Lithography technology) The understanding about the scaling technology and lithography technology
Class 7 Film deposition technology and etching technology The understanding about film deposition technology, etching technology etc
Class 8 Ion implantation technology The understanding about ion implantation technology
Class 9 Wet technology and CMP technology, and others The understanding about wet cleaning and chemical-mechanical polishing technology
Class 10 Interconnect technology, passive-device technology, and packaging technology The understanding about interconnect, passive device and assembling technologies, etc
Class 11 Memory device technology The understanding about memory devices such as latch circuits, SRAM, DRAM, Flash memory, PCM, RRAM, MRAM, STT-MRAM, FeRAM etc
Class 12 Sensor device technology and actuator device technology The understanding about sensor and accuator-device technologies
Class 13 Layout technology The understanding about layout technology
Class 14 The latest and future trends including new-type of FETs The understanding about new type of FET and the future technologies
Class 15 Test, yield and reliability for introfduction to VLSI engineering II The understanding about the test yield and reliability, and the introduction to VLSI engineering II

Textbook(s)

/Fundamentals of Modern VLSI Devices, 2nd Edition, Yuan Taur and Tak H. Ning, Cambridge University Press
/Semiconductor Manufactureing Technology, Michael Quirk and Julian Serda, Prentice Hall
/Nanoelectronics and Information Technology, Rainer Waser, Wilery-VCH

Reference books, course materials, etc.

Print out uploaded data on the OCW / OCW-i by yourself.

Assessment criteria and methods

No Examination. However, submit the report after lectures.

Related courses

  • EEE.C341 : Integrated Circuit Technology Integrated Circuit Technology
  • ICT.I303 : Integrated Circuit Design
  • ZUS.L201 : Basic Integrated Circuits

Prerequisites (i.e., required knowledge, skills, courses, etc.)

None

Contact information (e-mail and phone)    Notice : Please replace from "[at]" to "@"(half-width character).

Hitoshi Wakabayashi (wakabayashi.h.ab[at]m.titech.ac.jp)
Kuniyuki Kakushima (kakushima.k.aa[at]m.titech.ac.jp)

Other

None

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