Thin-film growth and micro-patterning process of functional ceramics are important technologies, which have realized high-performance electronic devices, such as smart phone and tablet terminal, and environment devices, such as power generation (storage) devices and LEDs. In this lecture, students study film-growth and device-fabrication technologies, as well as characterization methods of ceramic thin films. In the first half, the lecture focuses on basic of thin-film growth techniques, and in the last half, it focuses on micro-patterning technologies and characterization methods, in connection with actual devices.
Students will acquire the following skills by taking this course.
1) Learn the basic science of thin-film growth.
2) Acquire skills of film formation.
3) Learn device fabrication process.
4) Learn characterization techniques for thin films.
5) Understand application of thin-film technologies in the engineering field.
Ceramics thin film, thin-film growth, Physical vapor deposition, Chemical vapor deposition, Micro-patterning, Scanning probe microscope, Structure analysis, Chemical composition analysis, Surface analysis, Electronic state analysis, Electronic property, Optical property, Dielectric property, Thermoelectric property, Magnetic property, Superconducting property
|✔ Specialist skills||Intercultural skills||Communication skills||✔ Critical thinking skills||✔ Practical and/or problem-solving skills|
Exercise problems will be given.
|Course schedule||Required learning|
|Class 1||Introduction of thin-film technology||Students have to understand the importance of thin-film-growth technique, micro-patterning technology, and film-property characterization.|
|Class 2||Basic of thin-film growth||Students have to explain the thin-film form and crystal growth modes.|
|Class 3||Epitaxial growth, Hetero-junction, Superlattice||Students have to explain the epitaxial film growth, and fabrication method of hetero-junction and superlattice, on single crystalline substrate.|
|Class 4||Physical vapor deposition||Students have to explain the vacuum deposition and molecular beam epitaxy method.|
|Class 5||Physical vapor deposition (II)||Students have to explain the Sputtering and Laser ablation method.|
|Class 6||Chemical vapor deposition||Students have to explain the Chemical vapor deposition method.|
|Class 7||Special thin-film growth techniques||Students have to explain the solid-phase epitaxy, liquid-phase epitaxy, and solution process for thin-film growth.|
|Class 8||Thin-film micro-patterning technologies||Students have to explain patterning process by lithography and micro-patterning technologies by etching process|
|Class 9||Structural analysis||Students have to explain the crystal structure analysis of thin film by X-ray diffraction and electron microscope.|
|Class 10||Chemical composition and electronic state analysis||Students have to explain the chemical analysis and electronic state characterization of thin film.|
|Class 11||Surface analysis||Students have to explain the surface analysis of thin film by scanning probe microscope.|
|Class 12||Electronic properties of thin film and characterization methods||Students have to explain the characterization methods of electronic properties of thin film.|
|Class 13||Optical-dielectric properties of thin film and characterization methods||Students have to explain the characterization methods of optical-dielectric properties of thin film.|
|Class 14||Superconducting-magnetic-thermoelectric properties of thin film and characterization methods||Students have to explain the characterization methods of superconducting-magnetic-thermoelectric properties of thin film.|
To enhance effective learning, students are encouraged to spend approximately 100 minutes preparing for class and another 100 minutes reviewing class content afterwards (including assignments) for each class.
They should do so by referring to textbooks and other course material.
All materials used in class can be found on OCW-i in advance.
Reference books: Donald L. Smith ed. Thin-Film Deposition: Principles and Practice
Exercise problems (50%) will be given in the class every time and Reporting assignment (50%) will be give after the final class.