In this course, various bonding technologies, which are applied to highly reliable power modules for hybrid vehicles and so on, will be explained by showing the results of actual analysis. Students can learn importance of materials science in development of electronics devices.
This course in Tuesday class gives an overview of amorphous materials, mainly glass materials. Students can extend their knowledge on the fabrication techniques and characterizations of the materials. This course can give the special fabrication techniques and characterization not only for amorphous materials but also general information for various types of materials. The aim of this cause is to widen your knowledge about material research.
By the end of this course, students will be able to:
1. Understand phenomena in bonding processes and bonding mechanism
2. Understand the evaluation of bonding to ensure the performance of power devices
3. Understand the analysis method for micro-structure using electron microscopy
4. Understand usefulness of materials science through practical power modules analysis data
By the end of this course, the students can obtain knowledges as follows;
1. fabrication techniques for glasses and glass sciences
2. characterization techniques for glass structures
3. fabrication techniques for amorphous materials
4. fabrication techniques for materials by chemical solution process
power module, bonding technology, electron microscopy, device evaluation, Glasses, Amorphous materials, Characterization, Sol-gel method, Anodization
✔ Specialist skills | Intercultural skills | Communication skills | Critical thinking skills | ✔ Practical and/or problem-solving skills |
This course in Friday class is mainly composed of lecture. At the end of each class, a small report will be submitted and the subject will be explained at the next class in case of need.
This course in Tuesday class is mainly composed of lecture. At the end of each class, a small report will be submitted and the subject will be explained at the next class in case of need.
Course schedule | Required learning | |
---|---|---|
Class 1 | Introduction of glasses | Understand glass sciences and fabrication techniques |
Class 2 | Introduction, outline of power modules | Understand generic structures, function and the application of power modules. |
Class 3 | Characterization for glass structures (1) | Understand the characterization for glass structuresusing Excel calculation |
Class 4 | Evaluations of power modules | Understand the evaluation methods for power modules through the thermal stress analysis |
Class 5 | Characterization for glass structures (2) | Understand the characterization for glass structuresmanufacturing through the practice with thermodynamic calculation software |
Class 6 | Principal of electron microscopy (EM) and characterization of micro-structure | Understand the principal of scanning electron microscopy (SEM) / transmission electron microscopy (TEM) and how micro-structural information is obtained by using EM |
Class 7 | Fabrication of amorphous materials and introduction of sol-gel process | Understand the fabrication techniques for amorphous materials except for melting |
Class 8 | Preparation of materials by sol-gel process | Understand the fabrication of the materials such as bulks, films and powders by sol-gel processes |
Class 9 | Metal / metal bonding technologies and their mechanism | Understand the typical metal /metal bonding technologies such as soldering or brazing and their bonding mechanism |
Class 10 | Fabrication of oxide films by anodization | Understand the anodization of the metal |
Class 11 | Metal / ceramics bonding technologies and their mechanism | Understand the phenomena during metal / ceramics bonding process and its bonding mechanism |
Class 12 | Pattering process of the films | Understand the patterning processes of the films |
Class 13 | Fracture phenomena of power modules and improvement of reliability | Understand the fracture phenomena near the interfaces during the durability tests for power modules and their mechanism |
Class 14 | Novel bonding technologies for the next-generation power modules | Understand the requirements for the next-generation power modules which are adopted SiC or GaN instead of Si semiconductors and development of new bonding technologies |
Class 15 | Summary | Summarized |
Handouts will be distributed. It is recommended to bring a notebook computer with Windows OS, LAN or wireless LAN since thermodynamic calculation software and Microsoft Excel will be used in the course. Thermodynamic calculation software run only on windows OS will be installed into an individual PC. LAN or wireless LAN will be used to access a license server.
Handouts will be distributed. It is recommended to bring a notebook computer with Windows OS, LAN or wireless LAN since thermodynamic calculation software and Microsoft Excel will be used in the course. Thermodynamic calculation software run only on windows OS will be installed into an individual PC. LAN or wireless LAN will be used to access a license server.
Class attendance and final report.
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