It is very important to understand the large-scale integrated circuit (VLSI) technology to support the modern society in the underlying. Therefore, the CMOS integrated circuit will be discussed, in particular, scaling techniques, miniaturization technology (exposure technique, film forming technique, an etching technique, ion-implantation, CMP techniques, etc.), a memory device technology, sensor technology, actuator technology, interconnect technology, passive device technology, packaging technology, and others.
By course of this lecture, the goals is to understand the large-scale integrated circuits that support modern society. In addition, we aim to be able to apply to the actual integrated circuit design.
|✔ Applicable||How instructors' work experience benefits the course|
|In a half of this lecture, a teaching faculty member with 20 years of practical experiences used to be belonging to multiple companies in the field of device technologies for the VLSI Technology will provide valuable contents on basics and applications in the VLSI Technology, based on his practical experiences.|
Large-scale integrated circuit (VLSI) technology, CMOS integrated circuit, scaling technology, miniaturization technology, exposure technology, film formation technology, etching technology, CMP technology, memory device technology, sensor technology, actuator technology, wiring technology, passive device technology, packaging technology, and others
|✔ Specialist skills||Intercultural skills||Communication skills||Critical thinking skills||✔ Practical and/or problem-solving skills|
Lecture through Zoom
|Course schedule||Required learning|
|Class 1||CMOS integrated circuits and an inverter||The understanding about MOSFET, CMOS, inverter etc|
|Class 2||Logic circuits||The understanding about logic circuits|
|Class 3||Memory device technology (SRAM, DRAM)||The understanding about memory devices such as latch circuits, SRAM, DRAM|
|Class 4||Memory device technology (Flash and others)||Flash memory and others, such as PCM, RRAM, MRAM, STT-MRAM, FeRAM etc|
|Class 5||Sensor device technology (and actuator device technology)||The understanding about sensor (and actuator device) technologies|
|Class 6||Amplification circuit (and a differential amplifier)||The understanding about amplification circuits (and a differential amplifier, etc)|
|Class 7||Low-power circuits||The understanding about low-power consumption circuits, etc|
|Class 8||Overview of production technologies (wafer technology and clean technology)||Overview of process technologies, especially wafer technology and clean technology|
|Class 9||Film deposition technology and etching technology||The understanding about film deposition technology, etching technology etc|
|Class 10||Scaling technologies (Lithography technology)||The understanding about the scaling technology and lithography technology|
|Class 11||Ion implantation technology Wet technology and CMP technology, and others||The understanding about ion implantation technology The understanding about wet cleaning and chemical-mechanical polishing technology|
|Class 12||Interconnect technology, passive-device technology, and packaging technology||The understanding about interconnect, passive device and assembling technologies, etc|
|Class 13||Layout technology, test, yield and reliability||The understanding about layout technology, test yield and reliability|
|Class 14||Group presentations on advanced LSIs||Group presentations on advanced LSIs|
To enhance effective learning, students are encouraged to spend approximately 100 minutes preparing for class and another 100 minutes reviewing class content afterwards (including assignments) for each class.
They should do so by referring to textbooks and other course material.
/Fundamentals of Modern VLSI Devices, 2nd Edition, Yuan Taur and Tak H. Ning, Cambridge University Press
/Semiconductor Manufactureing Technology, Michael Quirk and Julian Serda, Prentice Hall
/Nanoelectronics and Information Technology, Rainer Waser, Wilery-VCH
Find uploaded data on the T2SCHOLA by yourself.
No Examination. However, submit the report after lectures.
Hitoshi Wakabayashi (wakabayashi.h.ab[at]m.titech.ac.jp)
Kuniyuki Kakushima (kakushima.k.aa[at]m.titech.ac.jp)