2020 Integrated Circuit Technology

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Academic unit or major
Undergraduate major in Electrical and Electronic Engineering
Instructor(s)
Wakabayashi Hitoshi 
Course component(s)
Lecture
Mode of instruction
ZOOM
Day/Period(Room No.)
Mon7-8(S221)  Thr7-8(S221)  
Group
-
Course number
EEE.C341
Credits
2
Academic year
2020
Offered quarter
4Q
Syllabus updated
2020/9/18
Lecture notes updated
-
Language used
Japanese
Access Index

Course description and aims

In electrical/electronic engineering and information/communication engineering, it is important to understand the integrated circuit technology to support the current electronics industry. Specific topics of lectures relate to CMOS integrated circuits, structures, manufacturing methods, design technology, testing technology, reliability, packaging technology, the signal transmission, the memory circuit, and interface circuits will be discussed to comprehensively understand.

Student learning outcomes

[Target] To understand the CMOS integrated circuits to support the current electronics industry. In addition, we aim to be able to apply to the actual integrated circuit design.
[Theme] In this lecture on CMOS integrated circuit, their structures, production method, design technology, test technology, reliability, packaging technology, signal transmission, a memory circuit, interface circuit will be discussed to comprehensively understand for the foundamentals on the electrical/electronic engineering and information communication engineering.

Course taught by instructors with work experience

Applicable How instructors' work experience benefits the course
In this lecture, a teaching faculty member with 20 years of practical experiences used to be belonging to multiple companies in the field of device technologies for integrated circuits will provide valuable contents on basics and applications in integrated circuit engineering, based on his practical experiences.

Keywords

CMOS integrated circuit, their structures, production method, design technology, test technology, reliability, packaging technology, signal transmission, a memory circuit, interface circuits

Competencies that will be developed

Specialist skills Intercultural skills Communication skills Critical thinking skills Practical and/or problem-solving skills
・Applied specialist skills on EEE

Class flow

Lecture and exercise

Course schedule/Required learning

  Course schedule Required learning
Class 1 Introduction on integrated circuits and their design and menufacturing flow Introduction about various functionalities in the smartphone and their manufacturing technology
Class 2 Basic process technologies in integrated circuit manufacturing Silicon wafer, lighography, film deposition, etching, wet cleaning, chemical-mechanical polishing and so on
Class 3 MOSFET and scaling law Operating principle of the MOSFET and its scaling law
Class 4 Electrical characteristics of CMOS logic circuits Understanding of the operation of CMOS inverter
Class 5 CMOS logic circuits The understanding of CMOS logic circuits, such as NAND, NOR and so on
Class 6 Electrical properties of the wiring Understanding on aluminum wiring, copper interconnect, a low dielectric constant film, air gap, repeater, H tree, the average wire length, and so on
Class 7 Logic circuit design The understanding of the logic circuit design techniques such as SPICE, RTL, HDL, C language design, and so on
Class 8 Memory circuits Latch circuit, SRAM, DRAM, Flash memory, PCM, RRAM, MRAM, STT-MRAM, FeRAM
Class 9 Layout design The understanding of the mask layout design techniques through exercises
Class 10 Test, yield and reliability The understanding of TEG, function test, reliability acceleration test, failure model, yield, cost and so on
Class 11 High-speed and low-power consumption technologies The understanding of drivability enhancement, voltage reduction, parasitic resistance and capacity reductions, power-gating, PLL technology and so on
Class 12 Interface circuit technology The understanding of amplifier, A/D conversion, D/A conversion, the differential transmission, radio transmission, and so on
Class 13 Packaging technology and future prospects of the integrated circuits Understanding of assembling technology and the future prospects of integrated circuits
Class 14 Confirmation of the understanding of all contents Confirmation of the understanding of all contents

Out-of-Class Study Time (Preparation and Review)

To enhance effective learning, students are encouraged to spend approximately 100 minutes preparing for class and another 100 minutes reviewing class content afterwards (including assignments) for each class.
They should do so by referring to textbooks and other course material.

Textbook(s)

Print out uploaded data on the OCW / OCW-i by yourself.

Reference books, course materials, etc.

Neil H. E. West and David Harris, “CMOS VLSI Design: A Circuits and Systems Perspective,” Fourth Edition, Addison Wesley.
Jan M. Rabaey, Anantha Chanfrakasan and Borivoje Nikolic, “Digital Integrated Circuits: A Design Perspective,” Second Edition, Printice Hall.

Assessment criteria and methods

Evaluated by final exam and exercise with 40% and 20%, respectively

Related courses

  • EEE.C202 : Electric Circuits II
  • EEE.C211 : Analog Electronic Circuits
  • EEE.C321 : Digital Electronic Circuits
  • EEE.D351 : Electron Devices I
  • EEE.D352 : Electron Devices II
  • EEE.D371 : Memory Devices
  • EEE.D391 : Semiconductor Fabirication Process
  • EEE.C201 : Electric Circuits I
  • SCE.E201 : Basic Theory of Electric Circuit

Prerequisites (i.e., required knowledge, skills, courses, etc.)

None

Contact information (e-mail and phone)    Notice : Please replace from "[at]" to "@"(half-width character).

Hitoshi Wakabayashi (wakabayashi.h.ab[at]m.titech.ac.jp)

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