In electrical/electronic engineering and information/communication engineering, it is important to understand the integrated circuit technology to support the current electronics industry. Specific topics of lectures relate to CMOS integrated circuits, structures, manufacturing methods, design technology, testing technology, reliability, packaging technology, the signal transmission, the memory circuit, and interface circuits will be discussed to comprehensively understand.
[Target] To understand the CMOS integrated circuits to support the current electronics industry. In addition, we aim to be able to apply to the actual integrated circuit design.
[Theme] In this lecture on CMOS integrated circuit, their structures, production method, design technology, test technology, reliability, packaging technology, signal transmission, a memory circuit, interface circuit will be discussed to comprehensively understand for the foundamentals on the electrical/electronic engineering and information communication engineering.
Corresponding educational goals are:
(1) Specialist skills: Fundamental specialist skills
(4) Applied skills (inquisitive thinking and/or problem-finding skills) Organization and analysis
(7) Skills acquiring a wide range of expertise, and expanding it into more advanced and other specialized areas
CMOS integrated circuit, their structures, production method, design technology, test technology, reliability, packaging technology, signal transmission, a memory circuit, interface circuits
|✔ Specialist skills||Intercultural skills||Communication skills||✔ Critical thinking skills||Practical and/or problem-solving skills|
Lecture and exercise
|Course schedule||Required learning|
|Class 1||Introduction on integrated circuits and their design and menufacturing flow||Introduction about various functionalities in the smartphone and their manufacturing technology|
|Class 2||Basic process technologies in integrated circuit manufacturing||Silicon wafer, lighography, film deposition, etching, wet cleaning, chemical-mechanical polishing and so on|
|Class 3||MOSFET and scaling law||Operating principle of the MOSFET and its scaling law|
|Class 4||Electrical characteristics of CMOS logic circuits||Understanding of the operation of CMOS inverter|
|Class 5||CMOS logic circuits||The understanding of CMOS logic circuits, such as NAND, NOR and so on|
|Class 6||Electrical properties of the wiring||Understanding on aluminum wiring, copper interconnect, a low dielectric constant film, air gap, repeater, H tree, the average wire length, and so on|
|Class 7||Logic circuit design||The understanding of the logic circuit design techniques such as SPICE, RTL, HDL, C language design, and so on|
|Class 8||Confirmation of understanding on previous contents and comments||Confirmation of the understanding of contents so far|
|Class 9||CMOS integrated circuit, their structures, production method, design technology, test technology, reliability, packaging technology, signal transmission, a memory circuit, interface circuits||Latch circuit, SRAM, DRAM, Flash memory, PCM, RRAM, MRAM, STT-MRAM, FeRAM|
|Class 10||Memory circuits||The understanding of the mask layout design techniques through exercises|
|Class 11||Test, yield and reliability||The understanding of TEG, function test, reliability acceleration test, failure model, yield, cost and so on|
|Class 12||High-speed and low-power consumption technologies||The understanding of drivability enhancement, voltage reduction, parasitic resistance and capacity reductions, power-gating, PLL technology and so on|
|Class 13||Interface circuit technology||The understanding of amplifier, A/D conversion, D/A conversion, the differential transmission, radio transmission, and so on|
|Class 14||Packaging technology and future prospects of the integrated circuits||Understanding of assembling technology and the future prospects of integrated circuits|
|Class 15||CMOS integrated circuit, their structures, production method, design technology, test technology, reliability, packaging technology, signal transmission, a memory circuit, interface circuits||Confirmation of the understanding of all contents|
Print out uploaded data on the OCW / OCW-i by yourself.
Neil H. E. West and David Harris, “CMOS VLSI Design: A Circuits and Systems Perspective,” Fourth Edition, Addison Wesley.
Jan M. Rabaey, Anantha Chanfrakasan and Borivoje Nikolic, “Digital Integrated Circuits: A Design Perspective,” Second Edition, Printice Hall.
Evaluated by midterm exam 40%, final exam 40%, exercise 20%
Hitoshi Wakabayashi (wakabayashi.h.ab[at]m.titech.ac.jp)