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2017　Integrated Circuit Technology Integrated Circuit Technology

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Academic unit or major
Undergraduate major in Electrical and Electronic Engineering
Instructor(s)
Masu Kazuya  Wakabayashi Hitoshi 
Class Format
Lecture     
Media-enhanced courses
Day/Period(Room No.)
Tue7-8(S222)  Thr7-8(S222)  
Group
-
Course number
EEE.C341
Credits
2
Academic year
2017
Offered quarter
4Q
Syllabus updated
2017/4/6
Lecture notes updated
-
Language used
Japanese
Access Index

Course description and aims

In electrical/electronic engineering and information/communication engineering, it is important to understand the integrated circuit technology to support the current electronics industry. Specific topics of lectures relate to CMOS integrated circuits, structures, manufacturing methods, design technology, testing technology, reliability, packaging technology, the signal transmission, the memory circuit, and interface circuits will be discussed to comprehensively understand.

Student learning outcomes

[Target] To understand the CMOS integrated circuits to support the current electronics industry. In addition, we aim to be able to apply to the actual integrated circuit design.
[Theme] In this lecture on CMOS integrated circuit, their structures, production method, design technology, test technology, reliability, packaging technology, signal transmission, a memory circuit, interface circuit will be discussed to comprehensively understand for the foundamentals on the electrical/electronic engineering and information communication engineering.

Keywords

CMOS integrated circuit, their structures, production method, design technology, test technology, reliability, packaging technology, signal transmission, a memory circuit, interface circuits

Competencies that will be developed

✔ Specialist skills Intercultural skills Communication skills Critical thinking skills Practical and/or problem-solving skills

Class flow

Lecture and exercise

Course schedule/Required learning

  Course schedule Required learning
Class 1 Introduction on integrated circuits and their design and menufacturing flow Introduction about various functionalities in the smartphone and their manufacturing technology
Class 2 Basic process technologies in integrated circuit manufacturing Silicon wafer, lighography, film deposition, etching, wet cleaning, chemical-mechanical polishing and so on
Class 3 MOSFET and scaling law Operating principle of the MOSFET and its scaling law
Class 4 Electrical characteristics of CMOS logic circuits Understanding of the operation of CMOS inverter
Class 5 CMOS logic circuits The understanding of CMOS logic circuits, such as NAND, NOR and so on
Class 6 Electrical properties of the wiring Understanding on aluminum wiring, copper interconnect, a low dielectric constant film, air gap, repeater, H tree, the average wire length, and so on
Class 7 Logic circuit design The understanding of the logic circuit design techniques such as SPICE, RTL, HDL, C language design, and so on
Class 8 Confirmation of understanding on previous contents and comments Confirmation of the understanding of contents so far
Class 9 CMOS integrated circuit, their structures, production method, design technology, test technology, reliability, packaging technology, signal transmission, a memory circuit, interface circuits Latch circuit, SRAM, DRAM, Flash memory, PCM, RRAM, MRAM, STT-MRAM, FeRAM
Class 10 Memory circuits The understanding of the mask layout design techniques through exercises
Class 11 Test, yield and reliability The understanding of TEG, function test, reliability acceleration test, failure model, yield, cost and so on
Class 12 High-speed and low-power consumption technologies The understanding of drivability enhancement, voltage reduction, parasitic resistance and capacity reductions, power-gating, PLL technology and so on
Class 13 Interface circuit technology The understanding of amplifier, A/D conversion, D/A conversion, the differential transmission, radio transmission, and so on
Class 14 Packaging technology and future prospects of the integrated circuits Understanding of assembling technology and the future prospects of integrated circuits
Class 15 CMOS integrated circuit, their structures, production method, design technology, test technology, reliability, packaging technology, signal transmission, a memory circuit, interface circuits Confirmation of the understanding of all contents

Textbook(s)

Print out uploaded data on the OCW / OCW-i by yourself.

Reference books, course materials, etc.

Neil H. E. West and David Harris, “CMOS VLSI Design: A Circuits and Systems Perspective,” Fourth Edition, Addison Wesley.
Jan M. Rabaey, Anantha Chanfrakasan and Borivoje Nikolic, “Digital Integrated Circuits: A Design Perspective,” Second Edition, Printice Hall.

Assessment criteria and methods

Evaluated by midterm exam 40%, final exam 40%, exercise 20%

Related courses

  • EEE.C202 ： Electric Circuits II
  • EEE.C211 ： Analog Electronic Circuits
  • EEE.C321 ： Digital Electronic Circuits
  • EEE.D351 ： Electron Devices I
  • EEE.D352 ： Electron Devices II
  • EEE.D371 ： Memory Devices
  • EEE.D391 ： Semiconductor Fabirication Process
  • EEE.C201 ： Electric Circuits I
  • SCE.E201 ： Basic Theory of Electric Circuit

Prerequisites (i.e., required knowledge, skills, courses, etc.)

None

Contact information (e-mail and phone)    Notice : Please replace from "[at]" to "@"(half-width character).

Kazuya Masu (masu.k.aa[at]m.titech.ac.jp)
Hitoshi Wakabayashi (wakabayashi.h.ab[at]m.titech.ac.jp)

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