Principles and limitations of micro-fabrication process in semiconductor devices for high-speed operation are described. After explanation of requirement of simultaneous miniaturization in vertical direction and lateral direction for high speed operations, latest technology with focus on lithography are explained. Then, formation of doped region, etching, oxidation, film formation, electrode and wiring are described.
By the end of this course, students will be able to:
1) Explain outlines of semiconductor processes which fabricated integrated circuit for popularization of cheap and high-speed electric circuits.
2) Understand the guidelines for more integration and higher speed.
3) Understand the method for miniaturization based on the scaling from principle operation of MOSFETs.
Lithography, formation of doped region, etching, oxidation, film formation, electrode, wiring
|✔ Specialist skills||Intercultural skills||Communication skills||Critical thinking skills||✔ Practical and/or problem-solving skills|
Because treated amount of knowledge is huge, each lecture ask simple calculation as homework. Any textbook or notebook can be used as reference in test level of understanding.
|Course schedule||Required learning|
|Class 1||Requirements of semiconductor fabrication process and basis of optical lithography||Relation between diffraction image and process factor k1|
|Class 2||Present status of optical lithography (with resist)||Calculation of images by alternative phase shift method|
|Class 3||Present status of electron beam lithography (with resist)||Calculation of proximity correction|
|Class 4||NGL and formation of doped region||Calculation of Stopping and Range of Ions in Matter.|
|Class 5||Etching and oxidation process||Calculation of SiO2 oxide thickness by some conditions|
|Class 6||Film formation||Change of deposition rate by change of stagnant layer thickness in CVD|
|Class 7||Electrode and wiring||Evaluation of contact by transfer line method|
|Class 8||Test level of understanding with exercise problems and summary of the course - Solve exercise problems -||Test level of understanding and self-evaluate achievement for classes 1–7.|
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Evaluate based on the students' knowledge of semiconductor processes.
42 %: Sum of homework, 58%:Test level of understanding